View ICX086AL_5672327.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

?1 ICX086AL e96649d99 diagonal 4.5mm (type 1/4) ccd image sensor for eia b/w video cameras description the ICX086AL is an interline ccd solid-state image sensor suitable for eia b/w video cameras. high sensitivity is achieved through the adoption of had (hole-accumulation diode) sensors. this chip features a field period readout system and an electronic shutter with variable charge-storage time. the package is a 10mm-square 14-pin dip (plastic). features high sensitivity and low dark current horizontal register: 3.3 to 5.0v drive no voltage adjustment (reset gate and substrate bias are not adjusted.) low smear continuous variable-speed shutter device structure interline ccd image sensor image size: diagonal 4.5mm (type 1/4) number of effective pixels: 510 (h) 492 (v) approx. 250k pixels total number of pixels: 537 (h) 505 (v) approx. 270k pixels chip size: 4.47mm (h) 3.80mm (v) unit cell size: 7.15m (h) 5.55m (v) optical black: horizontal (h) direction: front 2 pixels, rear 25 pixels vertical (v) direction: front 12 pixels, rear 1 pixel number of dummy bits: horizontal 16 vertical 1 (even fields only) substrate material: silicon sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. optical black position (top view) aaaaa a aaa a a aaa a a aaa a aaaaa pin 1 v 2 25 1 12 pin 8 h 14 pin dip (plastic)
? 2 ICX086AL 1 5 6 7 9 1 0 1 1 1 3 n o t e ) n o t e ) : p h o t o s e n s o r v o u t g n d v f 1 v f 2 v f 3 v f 4 v d d g n d f s u b v l r g h f 1 h f 2 h o r i z o n t a l r e g i s t e r 2 3 4 n c 1 2 1 4 8 v e r t i c a l r e g i s t e r substrate clock f sub ?gnd supply voltage clock input voltage voltage difference between vertical clock input pins voltage difference between horizontal clock input pins h f 1 , h f 2 ?v f 4 h f 1 , h f 2 ?gnd h f 1 , h f 2 ? f sub v l ? f sub v f 1 , v f 3 , v dd , v out ?v l rg ?gnd v f 2 , v f 4 , h f 1 , h f 2 , gnd ?v l storage temperature operating temperature block diagram and pin configuration (top view) pin no. 1 2 3 4 5 6 7 v f 4 v f 3 v f 2 v f 1 nc gnd v out vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock gnd signal output 8 9 10 11 12 13 14 v dd gnd f sub v l rg h f 1 h f 2 supply voltage gnd substrate clock protective transistor bias reset gate clock horizontal register transfer clock horizontal register transfer clock symbol description pin no. description pin description absolute maximum ratings ?.3 to +40 ?.3 to +18 ?0 to +9 ?5 to +16 to +10 to +15 to +16 ?6 to +16 ?0 to +15 ?5 to +10 ?5 to +0.3 ?.3 to +27.5 ?.3 to +20.5 ?.3 to +17.5 ?0 to +80 ?0 to +60 v v v v v v v v v v v v v v c c * 1 v dd , v out ?gnd v dd , v out ? f sub v f 1 , v f 2 , v f 3 , v f 4 ?gnd v f 1 , v f 2 , v f 3 , v f 4 ? f sub item ratings unit remarks * 1 +24v (max.) when clock width < 10 s, clock duty factor < 0.1%. symbol
? 3 ICX086AL clock voltage conditions item readout clock voltage v vt v vh1 , v vh2 v vh3 , v vh4 v vl1 , v vl2 , v vl3 , v vl4 v f v v vh3 ?v vh v vh4 ?v vh v vhh v vhl v vlh v vll v f h v hl v f rg v rglh ?v rgll v rgh v f sub 14.55 ?.05 ?.2 ?.0 6.8 ?.25 ?.25 3.0 ?.05 4.5 v dd + 0.3 21.5 15.0 0 0 ?.5 7.5 5.0 0 5.0 v dd + 0.6 22.5 15.45 0.05 0.05 ?.0 8.05 0.1 0.1 0.3 0.3 0.3 0.3 5.25 0.05 5.5 0.8 v dd + 0.9 23.5 v v v v v v v v v v v v v v v v v 1 2 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v f v = v vh n ?v vl n (n = 1 to 4) high-level coupling high-level coupling low-level coupling low-level coupling input through 0.01 f capacitance low-level coupling horizontal transfer clock voltage reset gate clock voltage substrate clock voltage vertical transfer clock voltage symbol min. typ. max. unit waveform diagram remarks bias conditions item supply voltage protective transistor bias substrate clock v dd v l f sub 14.55 15.0 * 1 * 2 15.45 v symbol min. typ. max. unit remarks dc characteristics item supply current i dd 4 6 ma symbol min. typ. max. unit remarks * 1 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same power supply as the v l power supply for the v driver should be used. * 2 do not apply a dc bias to the substrate clock pin, because a dc bias is generated within the ccd.
? 4 ICX086AL item capacitance between vertical transfer clock and gnd c f v1 , c f v3 c f v2 , c f v4 c f v12 , c f v34 c f v23 , c f v41 c f v13 , c f v24 c f h1 , c f h2 c f hh c f rg c f sub r 1 , r 2 , r 3 , r 4 r gnd r f h r f rg 680 820 180 150 62 30 18 3 190 33 15 24 40 pf pf pf pf pf pf pf pf pf w w w w capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor reset gate clock series resistor symbol min. typ. max. unit remarks r f h r f h h f 2 h f 1 c f h 1 c f h 2 c f h h v f 1 c f v 1 2 v f 2 v f 4 v f 3 c f v 3 4 c f v 2 3 c f v 4 1 c f v 1 3 c f v 2 4 c f v 1 c f v 2 c f v 4 c f v 3 r g n d r 4 r 1 r 3 r 2 v e r t i c a l t r a n s f e r c l o c k e q u i v a l e n t c i r c u i t h o r i z o n t a l t r a n s f e r c l o c k e q u i v a l e n t c i r c u i t r f r g r g f c f r g r e s e t g a t e c l o c k e q u i v a l e n t c i r c u i t clock equivalent circuit constant
? 5 ICX086AL d r i v e c l o c k w a v e f o r m c o n d i t i o n s ( 1 ) r e a d o u t c l o c k w a v e f o r m ( 2 ) v e r t i c a l t r a n s f e r c l o c k w a v e f o r m i i i i 1 0 0 % 9 0 % 1 0 % 0 % v v t t r t w h t f f m 0 v f m 2 v f 1 v f 3 v f 2 v f 4 v v h h v v h v v h l v v h h v v h l v v h 1 v v l 1 v v l h v v l l v v l v v h h v v h 3 v v h l v v h v v h h v v h l v v l 3 v v l v v l l v v l h v v h h v v h h v v h v v h l v v h l v v h 2 v v l h v v l 2 v v l l v v l v v h h v v h h v v h l v v h 4 v v h l v v h v v l v v l h v v l l v v l 4 v v h = ( v v h 1 + v v h 2 ) / 2 v v l = ( v v l 3 + v v l 4 ) / 2 v f v = v v h n v v l n ( n = 1 t o 4 )
? 6 ICX086AL t r t w h t f 9 0 % 1 0 % t w l v f h v h l p o i n t a t w l v f r g v r g h v r g l + 0 . 5 v v r g l v r g l h r g w a v e f o r m v r g l l h f 1 w a v e f o r m t w h t r t f 1 0 % 9 0 % 1 0 0 % 1 0 % 0 % ( a b i a s g e n e r a t e d w i t h i n t h e c c d ) v s u b t r t w h t f f m f m 2 v f s u b (3) horizontal transfer clock waveform (4) reset gate clock waveform v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v f rg = v rgh ?v rgl (5) substrate clock waveform
? 7 ICX086AL readout clock vertical transfer clock reset gate clock substrate clock v t v f 1 , v f 2 , v f 3 , v f 4 h f h f 1 h f 2 f rg f sub 2.3 41 11 1.5 2.5 46 5.6 14 1.65 41 76 46 5.6 80 0.1 6.5 0.007 0.007 6.0 9.5 0.5 5 0.1 6.5 0.007 0.007 5.0 250 9.5 0.5 s ns ns s ns s during imaging during parallel-serial conversion clock switching characteristics item during readout * 1 * 2 during drain charge symbol twh min. typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf unit remarks * 1 when vertical transfer clock driver cxd1267an is used. * 2 when v f h = 3.0v. tf 3 tr ?2ns, and the cross-point voltage (v cr ) for the h f 1 rising side of the h f 1 and h f 2 waveforms must be at least v f h /2 [v]. h o r i z o n t a l t r a n s f e r c l o c k
? 8 ICX086AL 1 0 9 4 9 2 ( v ) 8 1 0 5 1 0 ( h ) v 1 0 h 8 h 8 v 1 0 e f f e c t i v e p i x e l r e g i o n i g n o r e d r e g i o n z o n e 0 , i z o n e i i , i i ' image sensor characteristics (ta = 25 c) item sensitivity saturation signal smear video signal shading dark signal dark signal shading flicker lag s vsat sm sh vdt d vdt f lag 420 700 550 0.007 0.01 20 25 2 1 2 0.5 mv mv % % % mv mv % % 1 2 3 4 4 5 6 7 8 ta = 60 c zone 0 and i zone 0 to ii ' ta = 60 c ta = 60 c symbol min. typ. max. unit measurement method remarks zone definition of video signal shading
? 9 ICX086AL image sensor characteristics measurement method measurement conditions 1) in the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (ob) level is used as the reference for the signal output, and the value measured at point [ * a] in the drive circuit example is used. definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f8. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (vs) at the center of the screen and substitute the value into the following formula. 2. saturation signal set to standard imaging condition ii . after adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 200mv, measure the minimum value of the signal output. 3. smear set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 200mv. when the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value (vsm [mv]) of the signal output and substitute the value into the following formula. 4. video signal shading set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the signal output is 200mv. then measure the maximum (vmax [mv]) and minimum (vmin [mv]) values of the signal output and substitute the values into the following formula. sh = (vmax ?vmin)/200 100 [%] sm = 100 [%] (1/10v method conversion value) 200 vsm 500 1 10 1 s = vs [mv] 60 250
? 10 ICX086AL 5. dark signal measure the average value of the signal output (vdt [mv]) with the device ambient temperature 60 c and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. dark signal shading after measuring 5, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. ? vdt = vdmax ?vdmin [mv] 7. flicker set to standard imaging condition ii . adjust the luminous intensity so that the average value of the signal output is 200mv, and then measure the difference in the signal level between fields ( ? vf [mv]). then substitute the value into the following formula. f = ( ? vf/200) 100 [%] 8. lag adjust the signal output value generated by strobe light to 200mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (vlag). substitute the value into the following formula. lag = (vlag/200) 100 [%] v l a g ( l a g ) s i g n a l o u t p u t 2 0 0 m v l i g h t f l d v 1 s t r o b e l i g h t t i m i n g o u t p u t
? 11 ICX086AL c x d 1 2 6 7 a n 1 2 3 4 5 6 7 8 9 1 0 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 2 2 / 1 6 v 3 . 3 / 2 0 v 0 . 0 1 0 . 0 1 1 0 0 3 . 9 k 7 . 5 v 3 . 3 / 1 6 v 1 / 3 5 v 0 . 1 1 m 2 s k 5 2 3 i c x 0 8 6 ( b o t t o m v i e w ) 1 4 1 3 1 2 1 1 1 0 9 1 2 3 4 5 6 7 8 h f 1 h f 2 r g v l f s u b g n d v d d v f 4 v f 3 v f 2 v f 1 g n d n c v o u t 2 2 / 2 0 v c c d o u t 1 / 2 0 v 1 0 0 k 1 5 v x s u b x v 2 x v 1 x s g 1 x v 3 x s g 2 x v 4 h f 1 h f 2 r g 1 5 0 0 p 1 0 0 k [ * a ] drive circuit
? 12 ICX086AL r e l a t i v e r e s p o n s e 0 . 0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 . 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 w a v e l e n g t h [ n m ] u n i t : s o d d f i e l d e v e n f i e l d v 1 v 2 v 3 v 4 v 1 v 2 v 3 v 4 2 . 5 1 . 5 2 . 5 2 . 0 1 . 2 0 . 3 3 1 . 3 spectral sensitivity characteristics (excludes both lens characteristics and light source characteristics) sensor readout clock timing chart
? 13 ICX086AL h d 5 2 0 5 2 5 1 2 3 4 5 1 0 1 5 2 0 2 6 0 2 6 5 2 7 0 2 7 5 2 8 0 b l k v d f l d v 1 v 2 v 3 v 4 4 9 2 4 9 1 2 4 6 2 4 6 1 3 5 1 5 3 4 9 1 4 9 2 1 5 3 1 5 3 2 4 6 2 4 6 c c d o u t drive timing chart (vertical sync)
? 14 ICX086AL b l k h d h 1 h 2 r g v 1 v 2 v 3 v 4 s u b 5 0 0 5 0 5 5 1 0 1 2 5 1 0 1 5 2 0 2 5 3 1 1 2 3 5 1 0 1 5 1 6 1 2 2 3 5 1 0 drive timing chart (horizontal sync)
? 15 ICX086AL notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operation as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c o m p r e s s i v e s t r e n g t h 5 0 n c o v e r g l a s s p l a s t i c p a c k a g e 5 0 n 1 . 2 n m t o r s i o n a l s t r e n g t h a a a a a a a a a a a a a a a a a a a a a a a a
? 16 ICX086AL c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano- acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) the brown stain may be seen on the bottom or side of the package. but this does not affect the ccd characteristics. d) this package has 2 kinds of internal structure. however, their package outline, optical size, and strength are the same. the cross section of lead frame can be seen on the side of the package for structure a. a a a s t r u c t u r e a s t r u c t u r e b c h i p m e t a l p l a t e ( l e a d f r a m e ) p a c k a g e c r o s s s e c t i o n o f l e a d f r a m e
? 17 ICX086AL package outline unit: mm p a c k a g e s t r u c t u r e 2 . 5 7 . 0 2 . 5 1 . 0 0 . 5 5 . 0 1 4 5 . 0 1 8 . 9 7 1 0 . 0 0 . 1 8 . 9 1 0 . 0 0 . 1 8 1 0 . 1 6 0 t o 9 0 . 2 5 8 1 4 7 1 1 . 7 1 . 7 7 . 0 2 . 5 1 . 0 3 . 3 5 0 . 1 5 2 . 6 3 . 5 0 . 3 1 . 2 7 0 . 3 0 . 4 6 1 . 2 7 1 4 p i n d i p ( 4 0 0 m i l ) 0 . 3 v h 1 . a i s t h e c e n t e r o f t h e e f f e c t i v e i m a g e a r e a . 2 . t h e t w o p o i n t s b o f t h e p a c k a g e a r e t h e h o r i z o n t a l r e f e r e n c e . t h e p o i n t b ' o f t h e p a c k a g e i s t h e v e r t i c a l r e f e r e n c e . 3 . t h e b o t t o m c o f t h e p a c k a g e , a n d t h e t o p o f t h e c o v e r g l a s s d a r e t h e h e i g h t r e f e r e n c e . 4 . t h e c e n t e r o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o b a n d b ' i s ( h , v ) = ( 5 . 0 , 5 . 0 ) 0 . 1 5 m m . 5 . t h e r o t a t i o n a n g l e o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o h a n d v i s 1 . 6 . t h e h e i g h t f r o m t h e b o t t o m c t o t h e e f f e c t i v e i m a g e a r e a i s 1 . 4 1 0 . 1 0 m m . t h e h e i g h t f r o m t h e t o p o f t h e c o v e r g l a s s d t o t h e e f f e c t i v e i m a g e a r e a i s 1 . 9 4 0 . 1 5 m m . 7 . t h e t i l t o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o t h e b o t t o m c i s l e s s t h a n 2 5 m . t h e t i l t o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o t h e t o p d o f t h e c o v e r g l a s s i s l e s s t h a n 2 5 m . 8 . t h e t h i c k n e s s o f t h e c o v e r g l a s s i s 0 . 7 5 m m , a n d t h e r e f r a c t i v e i n d e x i s 1 . 5 . 9 . t h e n o t c h o f t h e p a c k a g e i s u s e d o n l y f o r d i r e c t i o n a l i n d e x , t h a t m u s t n o t b e u s e d f o r r e f e r e n c e o f f i x i n g . c d b a b ' ~ ~ ~ p a c k a g e m a t e r i a l l e a d t r e a t m e n t l e a d m a t e r i a l p a c k a g e w e i g h t p l a s t i c g o l d p l a t i n g 4 2 a l l o y 0 . 6 g m

▲Up To Search▲

Price & Availability of ICX086AL

	To Download ICX086AL Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .